Manufacturing method of semiconductor structure

ABSTRACT

Present disclosure provides a method for manufacturing a semiconductor device, including providing a substrate, forming a first III-V compound layer over the substrate, forming a first passivation layer over the first III-V compound layer, forming a first opening from a top surface of the first passivation layer to the first III-V compound layer, each opening having a stair-shaped sidewall at the first passivation layer, depositing a metal layer over the first passivation layer and in the first opening, the metal layer having a second opening above the corresponding first opening, and removing a portion of the metal layer to form a source electrode and a drain electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application to U.S. non-provisionalapplication No. 15/062,972, filed Mar. 7, 2016, and claims prioritythereto.

FIELD

The present disclosure relates generally to a semiconductor structureand a method of manufacturing a semiconductor structure.

BACKGROUND

In semiconductor technology, due to their characteristics, GroupIII-Group V (or III-V) semiconductor compounds are used to form variousintegrated circuit devices, such as high power field-effect transistors,high frequency transistors, or high electron mobility transistors(HEMTs). A HEMT is a field effect transistor incorporating a junctionbetween two materials with different band gaps (i.e., a heterojunction)as the channel instead of a doped region, as is generally the case formetal oxide semiconductor field effect transistors (MOSFETs). Incontrast with MOSFETs, HEMTs have a number of attractive propertiesincluding high electron mobility, the ability to transmit signals athigh frequencies, etc.

From an application point of view, enhancement-mode (E-mode) HEMTs havemany advantages. E-mode HEMTs allow elimination of negative-polarityvoltage supply, and, therefore, reduction of the circuit complexity andcost. Despite the attractive properties noted above, a number ofchallenges exist in connection with developing III-V semiconductorcompound-based devices. Various techniques directed at configurationsand materials of these III-V semiconductor compounds have beenimplemented to try and further improve transistor device performance.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a cross-sectional view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 1B illustrates an enlarged view of the semiconductor structure inFIG. 1A, taken along the dotted rectangle A in accordance with someembodiments of the present disclosure.

FIGS. 2A-2H are a series of cross-sectional views illustratingprocessing steps to fabricate the semiconductor structure, in accordancewith some embodiments of the present disclosure.

FIGS. 3A-3F are a series of cross-sectional views illustratingprocessing steps to fabricate the semiconductor structure, in accordancewith some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The making and using of the embodiments are discussed in detail below.It should be appreciated, however, that the present invention providesmany applicable inventive concepts that can be embodied in a widevariety of specific contexts. The specific embodiments discussed aremerely illustrative of specific ways to make and use the invention, anddo not limit the scope of the invention.

FIG. 1A is a cross-sectional view of a semiconductor structure 1according to one or more embodiments of the present disclosure. In someembodiments, the semiconductor structure 1 may be a high electronmobility transistor (HEMT). The semiconductor structure 1 includes asubstrate 10, a first III-V compound layer 13, a second III-V compoundlayer 11, isolation regions 12, a source region 14, a drain region 15, agate region, a first passivation layer 17, a second passivation layer 18and a buffer layer 19.

In some embodiments, the substrate 10 includes a silicon carbide (SiC)substrate, sapphire substrate or a silicon substrate. The semiconductorstructure 10 also includes a heterojunction formed between two differentsemiconductor material layers, such as material layers with differentband gaps. For example, the semiconductor structure 10 includes anon-doped narrow-band gap channel layer and a wide-band gap n-typedonor-supply layer.

The buffer layer 19 is on the substrate 10. The buffer layer 19 acts asthe buffer and/or the transition layer for the subsequently formedoverlying layers. The buffer layer 19 may be epitaxially grown usingMetal Organic Vapor Phase Epitaxy (MOVPE). The buffer layer 19 mayfunction as an interface to reduce lattice mismatch between substrate 10and the second III-V compound layer 11. In some embodiments, the bufferlayer 19 includes an aluminum nitride (AlN) layer having a thickness ina range between about 10 nanometers (nm) and about 300 nm. The bufferlayer 19 may include a single layer or a plurality of layers. Forexample, the buffer layer 19 may include a low-temperature AlN layer(not shown in the drawing) formed at a temperature between about 800° C.and about 1,200° C., and a high-temperature AlN layer (not shown in thedrawing) formed at a temperature between about 1,000° C. and about1,400° C.

The second III-V compound layer 11 is on the buffer layer 19. The secondIII-V compound layer 11 is a compound made from the III-V groups in theperiodic table of elements. In some embodiments of the present example,the second III-V compound layer 11 includes a gallium nitride (GaN)layer. In some embodiments, the second III-V compound layer 11 includesa GaAs layer or InP layer. In some embodiments, the second III-Vcompound layer 11 may be epitaxially grown by using, for example, MOVPE,during which a gallium-containing precursor and a nitrogen-containingprecursor are used. The gallium-containing precursor may includetrimethylgallium (TMG), triethylgallium (TEG), or other suitablegallium-containing chemicals. The nitrogen-containing precursor mayinclude ammonia (NH₃), tertiarybutylamine (TBAm), phenyl hydrazine, orother suitable chemicals.

The second III-V compound layer 11 is undoped. Alternatively, the secondIII-V compound layer 11 is unintentionally doped, such as lightly dopedwith n-type dopants due to a precursor used to form the second III-Vcompound layer 11. In some embodiments, the second III-V compound layer11 has a thickness in a range from about 0.5 microns (μm) to about 10μm.

The first III-V compound layer 13 is on the second III-V compound layer11. The first III-V compound layer 13 is a compound made from the III-Vgroups in the periodic table of elements. The first III-V compound layer13 and the second III-V compound layer 11 are different from each otherin composition. In some embodiments of the present example, the firstIII-V compound layer 13 includes an aluminum gallium nitride (AlGaN)layer. In some embodiments, the first III-V compound layer 13 includesan AlGaAs layer or an AlInP layer.

The first III-V compound layer 13 is intentionally doped. In someembodiments, the first III-V compound layer 13 has a thickness in arange from about 5 nm to about 50 nm.

The source region 14 is on the first III-V compound layer 13. In someembodiments, the source region 14 includes Au and comprises Al, Ti, Ni,Au or Cu. The drain region 15 is on the first III-V compound layer 13and spaced apart from the source region 14. In some embodiments, thedrain region 15 includes Au and comprises Al, Ti, Ni, Au or Cu.

The gate region 16 is on the first III-V compound layer 13 and betweenthe source region 14 and the drain region 15. The gate region 16includes a conductive material layer configured for voltage bias. Insome embodiments, the conductive material layer includes a refractorymetal or its compounds, e.g., titanium (Ti), titanium nitride (TiN),titanium tungsten (TiW) and tungsten (W). Alternatively, the conductivematerial layer includes nickel (Ni), gold (Au) or copper (Cu).

The isolation regions 12 are at both sides within the second III-Vcompound layer 11 and the first III-V compound layer 13. The isolationregions 12 isolate the HEMT in the semiconductor structure 1 from otherdevices in the substrate 10. In some embodiments, the isolation regions12 include doped regions with species of oxygen or nitrogen.

The first passivation layer 17 is on the first III-V compound layer 13and the isolation layers 12. The first passivation layer 17 surrounds aportion of the source region 14, the drain region 15 and the gate region16. The first passivation layer 17 is configured to protect theunderlying first III-V compound layer 13 from damage in the processhaving plasma. In some embodiments, the first passivation layer 17 has athickness in a range between about 100 Å and about 5,000 Å. In someembodiments, the first passivation layer 17 includes silicon oxideand/or silicon nitride. When comprising silicon nitride, the firstpassivation layer 17 may be formed by performing a Low-Pressure ChemicalVapor Deposition (LPCVD) method (without plasma) using SiH₄ and NH₃gases.

The second passivation layer 18 is on the first passivation layer 17 andcovers the remaining portions of the source region 14 and the drainregion 15 that are not covered by the first passivation layer 17. Insome examples, the second passivation layer 18 comprises silicon oxide,silicon nitride, gallium oxide, aluminum oxide, scandium oxide,zirconium oxide, lanthanum oxide or hafnium oxide.

In some embodiments, the semiconductor structure 1 may further include aprotection layer (not shown in the drawing). The protection layer isdisposed between the source region 14 and the second passivation layer18 and between the drain region 15 and the second passivation layer 18.The protection layer covers the source region 14 and the drain region15, and prevents the source region 14 and the drain region 15 fromexposure during an annealing process in the formation of the isolationregions 12.

In the above described embodiments, the gate region 16, the sourceregion 14 and the drain region 15 are configured as a transistor. When avoltage is applied to the gate stack, a device current of the transistorcould be modulated.

FIG. 1B illustrates an enlarged view of the source region 14 of thesemiconductor structure 1 of FIG. 1A, taken along the dotted rectangleA. As shown in FIG. 1B, the first III-V compound layer 13 has a concaveportion in which the source region 14 is located. The first III-Vcompound layer 13 is a compound made from the III-V groups in theperiodic table of elements. In some embodiments of the present example,the first III-V compound layer 13 includes an aluminum gallium nitride(AlGaN) layer. In some embodiments, the first III-V compound layer 13includes an AlGaAs layer or an AlInP layer. The first III-V compoundlayer 13 is intentionally doped. In some embodiments, the first III-Vcompound layer 13 has a thickness in a range from about 5 nm to about 50nm.

The first passivation layer 17 is located on the first III-V compoundlayer 13. The first passivation layer 17 has an opening. The sidewall ofthe opening has two stair-shaped portions 17 a. In some embodiments, theheight h1 of the sidewall of the concave portion and the lower step ofthe stepped-shape portion 17 a is greater than the height h2 of thesidewall of the upper step of the stepped-shape portion 17 a. In someembodiments, the width w1 of the stepped-shape portion 17 a is in arange from about 0.03 μm to about 0.05 μm.

The first passivation layer 17 is configured to protect the underlyingfirst III-V compound layer 13 from damage in plasma-related process. Insome embodiments, the first passivation layer 17 has a thickness in arange between about 100 Å and about 5,000 Å. In some embodiments, thefirst passivation layer 17 includes silicon oxide and/or siliconnitride. When comprising silicon nitride, the first passivation layer 17may be formed by performing a Low-Pressure Chemical Vapor Deposition(LPCVD) method (without plasma) using SiH₄ and NH₃ gases.

The source region 14 is located in a recess of the first passivationlayer 17 and a recess of the first III-V compound layer 13. In someembodiments, the source region 14 includes Au, Al, Ti, Ni, Au or Cu.

The second passivation layer 18 is on the first passivation layer 17 andcovers the portions of the source region 14 that are not covered by thefirst passivation layer 17. In some examples, the second passivationlayer 18 comprises silicon oxide, silicon nitride, gallium oxide,aluminum oxide, scandium oxide, zirconium oxide, lanthanum oxide orhafnium oxide.

As shown in FIG. 1A, the on resistance (Ron) of the semiconductorstructure 1 is proportional to the distance Lgs between the sourceregion 14 and the gate region 16, the width Lg of the gate region 16 andthe distance Lgd between the drain region 15 and the gate region 16. Thedistance Lgs includes the overlaying portion of the source region 14 andthe first passivation layer 17. Similarly, the distance Lgd includes theoverlaying portion of the drain region 15 and the first passivationlayer 17. According to the present disclosure, the length of overlayingportion is defined by the width w1 of the stepped-shape portion 17 a. Incomparison with the existing semiconductor structure (in which theoverlay length is about 0.2 μm), the semiconductor structure 1 shown inFIG. 1A has smaller overlaying length (in a range from about 0.03 μm toabout 0.05 μm). Reducing the overlay length would reduce the length Lgsand Lgd, which would in turn reduce the on resistance of thesemiconductor structure 1.

FIG. 2A to FIG. 2H are cross-sectional views of a CMOS-MEMS structurefabricated at various stages, in accordance with some embodiments of thepresent disclosure. Various figures have been simplified for a betterunderstanding of the inventive concepts of the present disclosure.

Referring to FIG. 2A, a substrate 20 is provided. The substrate 20includes a silicon carbide (SiC) substrate, sapphire substrate or asilicon substrate. The semiconductor structure 20 also includes aheterojunction formed between two different semiconductor materiallayers, such as material layers with different band gaps. For example,the semiconductor structure 20 includes a non-doped narrow-band gapchannel layer and a wide-band gap n-type donor-supply layer.

The buffer layer 29 is formed on the substrate 20. The buffer layer 29acts as the buffer and/or the transition layer for the subsequentlyformed overlying layers. The buffer layer 29 may be epitaxially grownusing Metal Organic Vapor Phase Epitaxy (MOVPE). The buffer layer 29 mayfunction as an interface to reduce lattice mismatch between substrate 20and the subsequently formed III-V compound layer. In some embodiments,the buffer layer 29 includes an aluminum nitride (AlN) layer having athickness in a range between about 10 nanometers (nm) and about 300 nm.The buffer layer 29 may include a single layer or a plurality of layers.For example, the buffer layer 29 may include a low-temperature AlN layer(not shown in the drawing) formed at a temperature between about 800° C.and about 1,200° C., and a high-temperature AlN layer (not shown in thedrawing) formed at a temperature between about 1,000° C. and about1,400° C.

The second III-V compound layer 21 is formed on the buffer layer 19. Thesecond III-V compound layer 21 is a compound made from the III-V groupsin the periodic table of elements. In some embodiments of the presentexample, the second III-V compound layer 21 includes a gallium nitride(GaN) layer. In some embodiments, the second III-V compound layer 21includes a GaAs layer or InP layer. In some embodiments, the secondIII-V compound layer 21 may be epitaxially grown by using, for example,MOVPE, during which a gallium-containing precursor and anitrogen-containing precursor are used. The gallium-containing precursormay include trimethylgallium (TMG), triethylgallium (TEG), or othersuitable gallium-containing chemicals. The nitrogen-containing precursormay include ammonia (NH₃), tertiarybutylamine (TBAm), phenyl hydrazine,or other suitable chemicals.

The second III-V compound layer 21 is undoped. Alternatively, the secondIII-V compound layer 21 is unintentionally doped, such as lightly dopedwith n-type dopants due to a precursor used to form the second III-Vcompound layer 21. In some embodiments, the second III-V compound layer21 has a thickness in a range from about 0.5 μm to about 10 μm.

The first III-V compound layer 23 is formed on the second III-V compoundlayer 21. The first III-V compound layer 23 is a compound made from theIII-V groups in the periodic table of elements. The first III-V compoundlayer 23 and the second III-V compound layer 21 are different from eachother in composition. In some embodiments of the present example, thefirst III-V compound layer 23 includes an aluminum gallium nitride(AlGaN) layer. In some embodiments, the first III-V compound layer 23includes an AlGaAs layer or an AlInP layer. The first III-V compoundlayer 23 is intentionally doped. In some embodiments, the first III-Vcompound layer 23 has a thickness in a range from about 5 nm to about 50nm. The first III-V compound layer 23 is epitaxially grown on the secondIII-V compound layer 21 by MOVPE using aluminum-containing precursor,gallium-containing precursor, and nitrogen-containing precursor. Thealuminum-containing precursor includes trimethylaluminum (TMA),triethylaluminium (TEA), or other suitable chemical. Thegallium-containing precursor includes TMG, TEG, or other suitablechemical. The nitrogen-containing precursor includes ammonia, TBAm,phenyl hydrazine, or other suitable chemical.

The isolation regions 22 are formed in the second III-V compound layer21 and at both edges of the first III-V compound layer 23. In someembodiments, the isolation regions 22 are formed by an implantationprocess with species of oxygen or nitrogen.

The first passivation layer 27 is formed on the first III-V compoundlayer 23 and the isolation layers 22. In some embodiments, the firstpassivation layer 27 has a thickness in a range between about 100 Å andabout 5,000 Å. In some embodiments, the first passivation layer 27includes silicon oxide and/or silicon nitride. In some embodiments, thefirst passivation layer 27 is formed by performing a low pressurechemical vapor deposition (LPCVD) method without plasma using SiH₄ andNH₃ gases. An operation temperature is in a range of from about 650° C.to about 800° C. An operation pressure is in a range of about 0.1 Torrand about 1 Torr. The first passivation layer 27 protects the underlyingfirst III-V compound layer 23 from damage in the following processeshaving plasma.

Referring to FIG. 2B, two openings 27 o are formed from the top surfaceof the first passivation layer 27 to a portion of the first III-Vcompound layer 23. Two openings 27 o in the first passivation layer 27are defined by lithography and etching processes to expose a portion ofthe first III-V compound layer 23. The opening 27 o is stair shape. Insome embodiments, the stair is around the middle portion of the sidewallof the first passivation layer 27, and thus the height h3 of the upperportion of the stepped-shape openings 27 o is less than the height h4 ofthe lower portion of the stepped-shape openings 27 o. In someembodiments, the width w2 of the step is in a range from about 0.03 μmto about 0.05 μm.

Referring to FIG. 2C, a metal layer 241 is deposited over the firstpassivation layer 27, filling into the openings of the first passivationlayer 27 and contacting the first III-V compound layer 23. In someembodiments, the metal layer 241 is deposited by using sputtering,atomic layer deposition (ALD) or physical vapor deposition (PVD)operations. In some embodiments, the metal layer 241 includes Au, Al,Ti, Ni, Au or Cu. The metal layer 241 has two openings 241 o locatedover the openings 27 o shown in FIG. 2B.

Referring to FIG. 2D, a photoresist (or mask) 241 m is placed on themetal layer 241 and filling into the openings 241 o of the metal layer241. The photoresist 241 m is patterned to serve as an etching mask.

Referring to FIG. 2E, an etching back operation is performed on thephotoresist 241 m to remove the photoresist from the top surface of themetal layer 241 and the remaining photoresist 241 m 1 is disposed in theopenings of the metal layer 241. As illustrated in FIG. 2E, a topsurface of the remaining photoresist 241 m 1 is lower than the topsurface of the metal layer 241. However, the top surface of theremaining photoresist 241 m 1 may be substantially at the same height orhigher than the top surface of the metal layer 241. The photoresistlayer can serve as the etch mask for subsequent operations. One ofordinary skill in the art would recognize many variations,modifications, and alternatives.

Referring to FIG. 2F, the metal layer 241 not covered by the photoresist241 m 1 is removed by an etching operation, such as a reactive ion etch(RIE) process that etches the exposed portions of the metal layer 241,is conducted and the etch until the underlying first passivation layer27 is exposed. The source region 24 and the drain region 25 can beobtained after the etching operation. The photoresist layer 241 m 1 isremoved after the formation of the source region 24 and the drain region25. During the etching operation, the photoresist 241 m reacts with therecessed sidewall of the metal layer 241 and form byproducts that areresistant to the RIE. The byproduct may be in a form of triangularregion (from a cross sectional view) surrounding the recessed sidewallof the metal layer 241. Because the byproduct region is resistant to theRIE, and at the same time, the byproduct region is disposed over thestep at the sidewall of the first passivation layer 27, serving as anetching stop-layer to prevent the metal layer from being etched furtherdown to the openings of the first passivation layer 27. The firstpassivation layer 27 protects the underlying first III-V compound layer23 from damage during the etching operation.

Note the source region 24 and the drain region 25 are formed by aself-align process where the photoresist 241 m 1 serves as an etchingmask defining the shape of the source region 24 and the drain region 25.

Next, a protection layer (not shown) is optionally deposited on thesource region 24, the drain region 25 and the first passivation layer27. In some embodiments, the protection layer includes dielectricmaterials such as SiO₂ or Si₃N₄. In one example, the protection layer isSi₃N₄. and is formed by performing a plasma enhanced chemical vapordeposition (PECVD) method.

Referring to FIG. 2G, a second passivation layer 28 is deposited on thesource region 24, the drain region 25 and the first passivation layer27. In some embodiments, the second passivation layer 28 is in athickness range from about 3 nm to about 20 nm. In some examples, thesecond passivation layer 28 comprises silicon oxide, silicon nitride,gallium oxide, aluminum oxide, scandium oxide, zirconium oxide,lanthanum oxide or hafnium oxide. In one embodiment, the secondpassivation layer 28 is formed by an atomic layer deposition (ALD)method. The ALD method is based on the sequential use of a gas phasechemical process. The majority of ALD reactions use two chemicals,typically called precursors. These precursors react with a surfaceone-at-a-time in a sequential manner. By exposing the precursors to thegrowth surface repeatedly, the second passivation layer 28 is deposited.The ALD method provides a uniform thickness of the second passivationlayer 28 with high quality. In one example, the second passivation layer28 is zirconium oxide. In some embodiments, a first precursor includestetrakis[ethylmethylamino]zirconium (TEMAZr) or zirconium chloride(ZrCl₄). In some embodiments, a second precursor includes oxygen inorder to oxidize the first precursor material to form a monolayer. Insome examples, the second precursor includes ozone (O₃), oxygen, water(H₂O), N₂O or H₂O₂. In other embodiments, the second passivation layer28 is formed by a plasma enhanced chemical vapor deposition (PECVD) or alow pressure chemical vapor deposition (LPCVD).

Referring to FIG. 2H, an opening is formed in the second passivationlayer 28 and the first passivation layer 27. The opening is disposedbetween the source region 24 and the drain region 25 to expose a topsurface of the first III-V compound layer 23. Then a metal layer isdeposited in the opening to from the gate region 26. In someembodiments, the gate region 26 includes a refractory metal or itscompounds, e.g., titanium (Ti), titanium nitride (TiN), titaniumtungsten (TiW) and tungsten (W). Alternatively, the gate region 26includes nickel (Ni), gold (Au) or copper (Cu).

As stated above, reducing the overlaying width of the source region andthe first passivation layer as well as the overlaying width of the drainregion and the first passivation layer would reduce the on resistance ofthe semiconductor structure. As shown in FIG. 2F, during the etchingoperation, the photoresist 241 m reacts with the recessed sidewall ofthe metal layer 241 and form byproducts that are resistant to the RIE.The byproduct may be in a form of triangular region (from a crosssectional view) surrounding the recessed sidewall of the metal layer241. Because the byproduct region is resistant to the RIE, and at thesame time, the byproduct region is disposed over the step at thesidewall of the first passivation layer 27, serving as an etchingstop-layer to prevent the metal layer from being etched further down tothe openings of the first passivation layer 27. The first passivationlayer 27 protects the underlying first III-V compound layer 23 fromdamage during the etching operation. Therefore, no further photoresistis required for metal layer etching to form the source region 24 and thedrain region 25. Therefore, in comparison with the existing approachesthat use a further photoresist for metal etching to form the sourceregion or drain region, the operations shown in FIGS. 2A-2H would reducethe manufacturing cost.

In addition, as shown in FIG. 2B, the overlaying width of thesource/drain region and the first passivation layer is defined by thewidth w2 of the stepped-shape sidewall of the first passivation layer27. In comparison with the existing semiconductor structure (in whichthe overlaying width is about 0.2 μm), the semiconductor structureformed by the operations shown in FIGS. 2A-2H has smaller overlayingwidth (in a range from about 0.03 μm to about 0.05 μm). Reducing theoverlaying width would reduce the on resistance of the semiconductordevice, which would in turn enhance the performance of the semiconductordevice.

FIG. 3A to FIG. 3F are cross-sectional views of a CMOS-MEMS structurefabricated at various stages, in accordance with some embodiments of thepresent disclosure. The manufacturing steps shown in FIG. 3A to FIG. 3Fare similar to those in FIG. 2C to FIG. 2H except that in FIG. 3A, ahard mask 31 is further deposited on the metal layer 241 by a CVDoperation. In some embodiments, the hard mask 31 is lining over thesidewall and heating element bottom of the opening 241 o of the metallayer 241. Subsequently, a portion of the hard mask 31 not in theopening 241 o is being removed. Referring to FIG. 3D, a portion of thehard mask 31 would be removed and only parts of the source region 24 andthe drain region 25 are covered by the hard mask 31. In someembodiments, the hard mask 31 includes nitrides or oxide. In someembodiments, the thickness of the hard mask 31 is in a range from about50 Å to 500 Å.

In view of the above, the present disclosure provides a semiconductorstructure with smaller on resistance by reducing the overlaying width ofthe source/drain region and the passivation layer. In addition, thepresent disclosure provides a method for manufacturing the semiconductorstructure by using self-aligned operation without using an extraphotoresist or hard mask to form the source/drain region.

One embodiment of the present disclosure provides a semiconductordevice. The semiconductor device comprises a substrate, a first III-Vcompound layer over the substrate, a first passivation layer on thefirst III-V compound layer, a source region and a drain region. Thesource region penetrates the first passivation layer to electricallycontact the first III-V compound layer. The drain region penetrates thefirst passivation layer to electrically contact the first III-V compoundlayer. A sidewall of the first passivation layer contacting with thesource region comprises a stair shape.

One embodiment of the present disclosure provides a high electronmobility transistor (HEMT). The HEMT comprises a substrate, a firstIII-V compound layer over the substrate, a first passivation layer onthe first III-V compound layer, a source region and a drain region. Thesource region penetrates the first passivation layer to electricallycontact the first III-V compound layer. The drain region penetrates thefirst passivation layer to electrically contact the first III-V compoundlayer. An upper portion of the source region overlays the firstpassivation layer, and a width of the upper portion overlaying the firstpassivation layer is in a range from approximately 0.03 μm toapproximately 0.05 μm.

One embodiment of the present disclosure provides a method ofmanufacturing a semiconductor device, comprising: providing a substrate,forming a first III-V compound layer over the substrate, forming a firstpassivation layer over the first III-V compound layer, forming a firstopening from a top surface of the first passivation layer to the firstIII-V compound layer, each opening having a stair-shaped sidewall at thefirst passivation layer, depositing a metal layer over the firstpassivation layer and in the first opening, the metal layer having asecond opening above the corresponding first opening, and removing aportion of the metal layer to form a source region and a drain region.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As those skilled in the art will readilyappreciate from the disclosure of the present disclosure, processes,machines, manufacture, composition of matter, means, methods or stepspresently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present disclosure. Accordingly, the appended claims are intended toinclude within their scope such as processes, machines, manufacture,compositions of matter, means, methods or steps/operations. In addition,each claim constitutes a separate embodiment, and the combination ofvarious claims and embodiments are within the scope of the disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, comprising: providing a substrate; forming a first III-Vcompound layer over the substrate; forming a first passivation layerover the first III-V compound layer; forming a first opening from a topsurface of the first passivation layer to the first III-V compoundlayer, each opening having a stair-shaped sidewall at the firstpassivation layer; depositing a metal layer over the first passivationlayer and in the first opening, the metal layer having a second openingabove the corresponding first opening; and removing a portion of themetal layer to form a source electrode and a drain electrode.
 2. Themethod of claim 1, wherein forming the source electrode and the drainelectrode further comprises: placing a photoresist over the metal layerand in the second opening; removing a portion of the photoresist untilthe remaining photoresist being in the second opening; and etching aportion of the metal layer not covered by the photoresist to form thesource electrode and the drain electrode.
 3. The method of claim 1,wherein the metal layer is deposited using sputtering, atomic layerdeposition (ALD) or physical vapor deposition (PVD).
 4. The method ofclaim 1, wherein a stair width of the stair-shaped sidewall is in arange from approximately 0.03 μm to approximately 0.05 μm.
 5. The methodof claim 1, before removing a portion of the metal layer, furthercomprising forming a hard mask lining the second opening of the metallayer.
 6. The method of claim 5, further comprising placing aphotoresist over the metal layer and in the second opening after formingthe hard mask.
 7. The method of claim 1, wherein removing the portion ofthe metal layer comprises performing a reactive ion etch operation. 8.The method of claim 1, further comprising: forming a second passivationlayer over the source electrode and the drain electrode after removingthe portion of the metal layer; and forming an opening in the secondpassivation layer and the first passivation layer between the sourceelectrode and the drain electrode.
 9. A method for manufacturing asemiconductor device, comprising: providing a substrate; forming a firstIII-V compound layer over the substrate; forming a first opening from atop surface of the first III-V compound layer; depositing a metal layerin the first opening, the metal layer having a second opening above thecorresponding first opening; forming a photoresist in the secondopening; and removing a portion of the metal layer to form a sourceelectrode and a drain electrode.
 10. The method of claim 9, whereinforming the photoresist in the second opening comprises: forming aphotoresist layer over the metal layer and filling the second opening ofthe metal layer; and etching back the photoresist layer to expose a topsurface of the metal layer.
 11. The method of claim 9, wherein formingthe first opening from the top surface of the first III-V compound layercomprises: forming a first passivation layer over the first III-Vcompound layer; and forming the first opening in the first passivationlayer and the III-V compound layer.
 12. The method of claim 11, whereinthe first opening comprises a lower portion and an upper portion, thelower portion is narrower than the upper portion.
 13. The method ofclaim 12, wherein the lower portion is narrower than the upper portionby approximately 0.06 μm to approximately 0.10 μm.
 14. The method ofclaim 11, wherein depositing the metal layer in the first openingcomprises depositing the metal layer over a top surface and in the firstopening of the passivation layer.
 15. The method of claim 9, whereindepositing the metal layer comprises sputtering, atomic layer deposition(ALD) or physical vapor deposition (PVD).
 16. The method of claim 9,wherein removing the portion of the metal layer comprises performing areactive ion etch operation.
 17. A method for manufacturing asemiconductor device, comprising: providing a substrate; forming a firstIII-V compound layer over the substrate; forming a first opening from atop surface of the first III-V compound layer; depositing a metal layerin the first opening, the metal layer having a second opening above thecorresponding first opening; and removing a portion of the metal layerto form a source electrode, the source electrode comprising: an upperpart having a first width; and a lower part having a second width, thefirst width being greater than the second width, wherein an upperportion of the source electrode further comprises a third width measuredfrom one side to an opposite side of an outer circumference of the upperportion, the third width being smaller than the first width.
 18. Themethod of claim 17, further comprising forming a passivation layer overthe upper portion of the source electrode having the third width. 19.The method of claim 18, further comprising forming a second opening inthe passivation layer and adjacent to the source electrode.
 20. Themethod of claim 17, further comprising forming a hard mask lining thesecond opening of the metal layer.